ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits

Please use this identifier to cite or link to this item: http://dspace.mediu.edu.my:8181/xmlui/handle/1721.1/4112

Full metadata record

DC Field	Value	Language
dc.contributor	Alam, Syed Mohiul, 1975-	-
dc.date	2004-03-02T18:26:26Z	-
dc.date	2004-03-02T18:26:26Z	-
dc.date	2001	-
dc.date	2001	-
dc.date.accessioned	2013-10-09T02:34:03Z	-
dc.date.available	2013-10-09T02:34:03Z	-
dc.date.issued	2013-10-09	-
dc.identifier	http://hdl.handle.net/1721.1/4112	-
dc.identifier.uri	http://koha.mediu.edu.my:8181/xmlui/handle/1721	-
dc.description	by Syed Mohiul Alam.	-
dc.description	Supervised by Donald E. Troxel and Carl V. Thompson.	-
dc.description	Also issued as Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2001.	-
dc.description	Includes bibliographical references (p. 107-112).	-
dc.format	112 p.	-
dc.format	7027671 bytes	-
dc.format	application/pdf	-
dc.language	eng	-
dc.relation	Technical report (Massachusetts Institute of Technology. Research Laboratory of Electronics) ; 652.	-
dc.title	ERNI-3D : a technology-generic tool for interconnect reliability projections in 3D integrated circuits	-
dc.title	Technology-generic tool for interconnect reliability projections in 3D integrated circuits	-
Appears in Collections:	MIT Items

Files in This Item:

There are no files associated with this item.

DSpace JSPUI