Please use this identifier to cite or link to this item: http://dspace.mediu.edu.my:8181/xmlui/handle/1721.1/7297
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dc.creatorChu, Richard C.-
dc.date2004-10-26T17:00:25Z-
dc.date2004-10-26T17:00:25Z-
dc.date2003-05-
dc.date.accessioned2013-10-09T02:40:07Z-
dc.date.available2013-10-09T02:40:07Z-
dc.date.issued2013-10-09-
dc.identifierhttp://hdl.handle.net/1721.1/7297-
dc.identifier.urihttp://koha.mediu.edu.my:8181/xmlui/handle/1721-
dc.format2383772 bytes-
dc.formatapplication/pdf-
dc.languageen_US-
dc.titleThermal management roadmap: Cooling electronic products from hand-held devices to supercomputers-
dc.typePresentation-
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