Please use this identifier to cite or link to this item: http://dspace.mediu.edu.my:8181/xmlui/handle/1721.1/7313
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DC FieldValueLanguage
dc.creatorChu, R.C.-
dc.creatorBar-Cohen, Avi-
dc.creatorEdwards, David-
dc.creatorHerrlin, Magnus-
dc.creatorPrice, Donald-
dc.creatorSchmidt, Roger-
dc.creatorJoshi, Jogenda-
dc.creatorChryser, George M.-
dc.creatorGarimella, Suresh-
dc.creatorMok, Larry-
dc.creatorSammakia, Bahgat-
dc.creatorYeh, Lian-Tuu-
dc.date2004-10-29T19:41:35Z-
dc.date2004-10-29T19:41:35Z-
dc.date2003-05-
dc.date.accessioned2013-10-09T02:49:04Z-
dc.date.available2013-10-09T02:49:04Z-
dc.date.issued2013-10-09-
dc.identifierhttp://hdl.handle.net/1721.1/7313-
dc.identifier.urihttp://koha.mediu.edu.my:8181/xmlui/handle/1721-
dc.format2383772 bytes-
dc.formatapplication/pdf-
dc.languageen_US-
dc.titleThermal management roadmap: Cooling electronic products from hand-held dvices to supercomputers-
dc.typePresentation-
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