| dc.creator |
Liew, K.P. |
|
| dc.creator |
Li, Yi |
|
| dc.creator |
Yeadon, Mark |
|
| dc.creator |
Bernstein, R. |
|
| dc.creator |
Thompson, Carl V. |
|
| dc.date |
2003-11-10T19:18:00Z |
|
| dc.date |
2003-11-10T19:18:00Z |
|
| dc.date |
2003-01 |
|
| dc.date.accessioned |
2013-10-09T02:31:49Z |
|
| dc.date.available |
2013-10-09T02:31:49Z |
|
| dc.date.issued |
2013-10-09 |
|
| dc.identifier |
http://hdl.handle.net/1721.1/3658 |
|
| dc.identifier.uri |
http://koha.mediu.edu.my:8181/xmlui/handle/1721 |
|
| dc.description |
An curvature measurement technique was used to characterize the stress evolution during reaction of a Ni film and a silicon substrate to form nickel silicide. Stress changes were measured at each stage of the silicide growth. When the nickel films were subjected to long-time isothermal annealing, stresses that developed during silicide formation gradually relaxed. Fitting the experimental results with a kinetic model provides insight into the volumetric strain and relaxation behavior of the reacting film and the reaction product. |
|
| dc.description |
Singapore-MIT Alliance (SMA) |
|
| dc.format |
379507 bytes |
|
| dc.format |
application/pdf |
|
| dc.language |
en_US |
|
| dc.relation |
Advanced Materials for Micro- and Nano-Systems (AMMNS); |
|
| dc.subject |
nickel silicide |
|
| dc.subject |
stress evolution |
|
| dc.subject |
Coble creep |
|
| dc.title |
Characterization and Modeling of Stress Evolution During Nickel Silicides Formation |
|
| dc.type |
Article |
|