| dc.creator |
Spearing, S. Mark |
|
| dc.date |
2003-11-10T19:49:43Z |
|
| dc.date |
2003-11-10T19:49:43Z |
|
| dc.date |
2003-01 |
|
| dc.date.accessioned |
2013-10-09T02:31:52Z |
|
| dc.date.available |
2013-10-09T02:31:52Z |
|
| dc.date.issued |
2013-10-09 |
|
| dc.identifier |
http://hdl.handle.net/1721.1/3667 |
|
| dc.identifier.uri |
http://koha.mediu.edu.my:8181/xmlui/handle/1721 |
|
| dc.description |
An overview is provided of materials and processes research currently being conducted in support of MEMS device design at MIT. Underpinning research is being conducted in five areas: room temperature strength characterization, elevated temperature strength characterization, processing of Si/SiC hybrid structures, modeling of wafer bonding processes and development of high temperature fluid interconnections. Emphasis is placed on the key areas of materials science and engineering. |
|
| dc.description |
Singapore-MIT Alliance (SMA) |
|
| dc.format |
1000149 bytes |
|
| dc.format |
application/pdf |
|
| dc.language |
en_US |
|
| dc.relation |
Advanced Materials for Micro- and Nano-Systems (AMMNS); |
|
| dc.subject |
microelectromechanical systems |
|
| dc.subject |
mechanical properties |
|
| dc.subject |
process development |
|
| dc.subject |
process modeling |
|
| dc.title |
MEMS Materials and Processes: a research overview |
|
| dc.type |
Article |
|