| dc.creator |
Pitera, Arthur J. |
|
| dc.creator |
Groenert, M. E. |
|
| dc.creator |
Yang, V. K. |
|
| dc.creator |
Lee, Minjoo L. |
|
| dc.creator |
Leitz, Christopher W. |
|
| dc.creator |
Taraschi, G. |
|
| dc.creator |
Cheng, Zhiyuan |
|
| dc.creator |
Fitzgerald, Eugene A. |
|
| dc.date |
2003-11-20T22:05:13Z |
|
| dc.date |
2003-11-20T22:05:13Z |
|
| dc.date |
2003-01 |
|
| dc.date.accessioned |
2013-10-09T02:31:52Z |
|
| dc.date.available |
2013-10-09T02:31:52Z |
|
| dc.date.issued |
2013-10-09 |
|
| dc.identifier |
http://hdl.handle.net/1721.1/3714 |
|
| dc.identifier.uri |
http://koha.mediu.edu.my:8181/xmlui/handle/1721 |
|
| dc.description |
A research synopsis is presented summarizing work with integration of Ge and III-V semiconductors and optical devices with Si. III-V GaAs/AlGaAs quantum well lasers and GaAs/AlGaAs optical circuit structures have been fabricated on Si using Ge/GeSi/Si virtual substrates. The lasers fabricated on bulk GaAs showed similar output characteristics as those on Si. The GaAs/AlGaAs lasers fabricated on Si emitted at 858nm and had room temperature cw lifetimes of ~4hours. Straight optical links integrating an LED emitter, waveguide and detector exhibited losses of approximately 144dB/cm. A process for fabrication of a novel CMOS-compatible platform that integrates III-V or Ge layers with Si is demonstrated. Thin Ge layers have been transferred from Ge/GeSi/Si virtual substrates to bulk Si utilizing wafer bonding and an epitaxial Si CMP layer to facilitate virtual substrate planarization. A unique CMP-less method for removal of Ge exfoliation damage induced by the SmartCutâ ¢ process is also presented. |
|
| dc.description |
Singapore-MIT Alliance (SMA) |
|
| dc.format |
886237 bytes |
|
| dc.format |
application/pdf |
|
| dc.language |
en_US |
|
| dc.relation |
Advanced Materials for Micro- and Nano-Systems (AMMNS); |
|
| dc.subject |
chemo-mechanical planarization |
|
| dc.subject |
GaAs/AlGaAs lasers |
|
| dc.subject |
GeSi virtual substrates |
|
| dc.subject |
optical circuit |
|
| dc.subject |
wafer bonding |
|
| dc.title |
Novel CMOS-Compatible Optical Platform |
|
| dc.type |
Article |
|