| dc.creator |
Spearing, S. Mark |
|
| dc.creator |
Tsau, Christine H. |
|
| dc.creator |
Schmidt, Martin A. |
|
| dc.date |
2003-12-13T16:41:31Z |
|
| dc.date |
2003-12-13T16:41:31Z |
|
| dc.date |
2004-01 |
|
| dc.date.accessioned |
2013-10-09T02:32:39Z |
|
| dc.date.available |
2013-10-09T02:32:39Z |
|
| dc.date.issued |
2013-10-09 |
|
| dc.identifier |
http://hdl.handle.net/1721.1/3828 |
|
| dc.identifier.uri |
http://koha.mediu.edu.my:8181/xmlui/handle/1721 |
|
| dc.description |
Thermocompression bonding of gold is a promising technique for the fabrication and packaging microelectronic and MEMS devices. The use of a gold interlayer and moderate temperatures and pressures results in a hermetic, electrically conductive bond. This paper documents work conducted to model the effect of patterning in causing pressure non-uniformities across the wafer and its effect on the subsequent fracture response. A finite element model was created that revealed pattern-dependent local pressure variations of more than a factor of three. This variation is consistent with experimental observations of bond quality across individual wafers A cohesive zone model was used to investigate the resulting effect of non-uniform bond quality on the fracture behavior. A good, qualitative agreement was obtained with experimental observations of the load-displacement response of bonds in fracture tests. |
|
| dc.description |
Singapore-MIT Alliance (SMA) |
|
| dc.format |
918454 bytes |
|
| dc.format |
application/pdf |
|
| dc.language |
en_US |
|
| dc.relation |
Advanced Materials for Micro- and Nano-Systems (AMMNS); |
|
| dc.subject |
wafer bonding |
|
| dc.subject |
thermocompression |
|
| dc.subject |
cohesive zone |
|
| dc.title |
Gold Thermocompression Wafer Bonding |
|
| dc.type |
Article |
|