| dc.creator |
Barkley, Edward |
|
| dc.creator |
Fonstad, Clifton G. Jr. |
|
| dc.date |
2003-12-20T17:27:58Z |
|
| dc.date |
2003-12-20T17:27:58Z |
|
| dc.date |
2004-01 |
|
| dc.date.accessioned |
2013-10-09T02:33:41Z |
|
| dc.date.available |
2013-10-09T02:33:41Z |
|
| dc.date.issued |
2013-10-09 |
|
| dc.identifier |
http://hdl.handle.net/1721.1/3963 |
|
| dc.identifier.uri |
http://koha.mediu.edu.my:8181/xmlui/handle/1721 |
|
| dc.description |
This paper describes recent progress in a continuing program to develop and apply RM³ (recess mounting with monolithic metallization) technologies for heterogeneous integration. Particular emphasis is placed on the applicability of RM³ integration to in-plane geometries for on-chip optical clock and signal distribution and on the suitability of commercially processed IC wafers for use as substrates for rectangular dielectric waveguides. |
|
| dc.description |
Singapore-MIT Alliance (SMA) |
|
| dc.format |
354502 bytes |
|
| dc.format |
application/pdf |
|
| dc.language |
en |
|
| dc.relation |
Advanced Materials for Micro- and Nano-Systems (AMMNS); |
|
| dc.subject |
optoelectronic integration |
|
| dc.subject |
heterogeneous integration |
|
| dc.subject |
hybrid assembly |
|
| dc.subject |
in-plane laser diodes |
|
| dc.subject |
rectangular dielectric waveguides |
|
| dc.title |
RM³ Processing for In-plane Optical Interconnects on Si-CMOS and the Impact of Topographic Features on Losses in Deposited Dielectric Waveguides |
|
| dc.type |
Article |
|