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Atomistic Simulations of Metallic Cluster Coalescence

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dc.creator Takahashi, A. R.
dc.creator Thompson, Carl V.
dc.creator Carter, W. Craig
dc.date 2003-12-20T19:00:27Z
dc.date 2003-12-20T19:00:27Z
dc.date 2002-01
dc.date.accessioned 2013-10-09T02:33:20Z
dc.date.available 2013-10-09T02:33:20Z
dc.date.issued 2013-10-09
dc.identifier http://hdl.handle.net/1721.1/3968
dc.identifier.uri http://koha.mediu.edu.my:8181/xmlui/handle/1721
dc.description A new computational method is introduced to investigate the stresses developed in the island-coalescence stage of polycrystalline film formation during deposition. The method uses molecular dynamics to examine the behavior of clusters of atoms both in free space and on substrates. Continuum treatments used in previous models may not be applicable at small length scales or low dimensionality. In atomistic simulations, the effects of surface diffusion, bond straining and defect formation can be directly studied. TEM experiments will be used to evaluate the validity of the simulation model.
dc.description Singapore-MIT Alliance (SMA)
dc.format 43588 bytes
dc.format application/pdf
dc.language en_US
dc.relation Advanced Materials for Micro- and Nano-Systems (AMMNS);
dc.subject modeling
dc.subject simulation
dc.subject stress
dc.subject thin films
dc.title Atomistic Simulations of Metallic Cluster Coalescence
dc.type Article


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