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Length Effects on the Reliability of Dual-Damascene Cu Interconnects

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dc.creator Wei, F.
dc.creator Hau-Riege, S.P.
dc.creator Gan, C.L.
dc.creator Thompson, Carl V.
dc.creator Clement, J.J.
dc.creator Tay, H.L.
dc.creator Yu, B.
dc.creator Radhakrishnan, M.K.
dc.creator Pey, Kin Leong
dc.creator Choi, Wee Kiong
dc.date 2003-12-20T19:42:21Z
dc.date 2003-12-20T19:42:21Z
dc.date 2002-01
dc.date.accessioned 2013-10-09T02:33:23Z
dc.date.available 2013-10-09T02:33:23Z
dc.date.issued 2013-10-09
dc.identifier http://hdl.handle.net/1721.1/3977
dc.identifier.uri http://koha.mediu.edu.my:8181/xmlui/handle/1721
dc.description The effects of interconnect length on the reliability of dual-damascene Cu metallization have been investigated. As in Al-based interconnects, the lifetimes of Cu lines increase with decreasing length. However, unlike Al-based interconnects, no critical length exists, below which all Cu lines are â immortal’. Furthermore, we found multi-modal failure statistics for long lines, suggesting multiple failure mechanisms. Some long Cu interconnect segments have very large lifetimes, whereas in Al segments, lifetimes decrease continuously with increasing line length. It is postulated that the large lifetimes observed in long Cu lines result from liner rupture at the bottom of the vias, which allows continuous flow of Cu between the two bond pads. As a consequence, the average lifetimes of short lines and long lines can be higher than those of lines with intermediate lengths.
dc.description Singapore-MIT Alliance (SMA)
dc.format 228936 bytes
dc.format application/pdf
dc.language en_US
dc.relation Advanced Materials for Micro- and Nano-Systems (AMMNS);
dc.subject interconnects
dc.subject reliability
dc.subject length effects
dc.title Length Effects on the Reliability of Dual-Damascene Cu Interconnects
dc.type Article


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