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SiGe-On-Insulator (SGOI) Technology and MOSFET Fabrication

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dc.creator Cheng, Zhiyuan
dc.creator Fitzgerald, Eugene A.
dc.creator Antoniadis, Dimitri A.
dc.date 2003-12-22T20:48:14Z
dc.date 2003-12-22T20:48:14Z
dc.date 2002-01
dc.date.accessioned 2013-10-09T02:33:27Z
dc.date.available 2013-10-09T02:33:27Z
dc.date.issued 2013-10-09
dc.identifier http://hdl.handle.net/1721.1/3986
dc.identifier.uri http://koha.mediu.edu.my:8181/xmlui/handle/1721
dc.description In this work, we have developed two different fabrication processes for relaxed Si₁₋xGex-on-insulator (SGOI) substrates: (1) SGOI fabrication by etch-back approach, and (2) by "smart-cut" approach utilizing hydrogen implantation. Etch-back approach produces SGOI substrate with less defects in SiGe film, but the SiGe film uniformity is inferior. "Smart-cut" approach has better control on the SiGe film thickness and uniformity, and is applicable to wider Ge content range of the SiGe film. We have also fabricated strained-Si n-MOSFET’s on SGOI substrates, in which epitaxial regrowth was used to produce the surface strained Si layer on relaxed SGOI substrate, followed by large-area n-MOSFET’s fabrication on this structure. The measured electron mobility shows significant enhancement (1.7 times) over both the universal mobility and that of co-processed bulk-Si MOSFET’s. This SGOI process has a low thermal budget and thus is compatible with a wide range of Ge contents in Si₁₋xGex layer.
dc.description Singapore-MIT Alliance (SMA)
dc.format 105803 bytes
dc.format application/pdf
dc.language en_US
dc.relation Advanced Materials for Micro- and Nano-Systems (AMMNS);
dc.subject strained-Si
dc.subject SiGe
dc.subject SiGe-on-Insulator
dc.subject SGOI
dc.subject SOI
dc.subject MOSFET
dc.subject mobility
dc.subject bonding
dc.subject etch-back
dc.subject etch-stop
dc.subject smart-cut
dc.subject hydrogen implantation
dc.title SiGe-On-Insulator (SGOI) Technology and MOSFET Fabrication
dc.type Article


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