Orienting Silicon Integrated Circuit Chips for Lead Bonding

dc.creator	Horn, Berthold K.P.
dc.date	2004-10-01T20:37:25Z
dc.date	2004-10-01T20:37:25Z
dc.date	1975-01-01
dc.date.accessioned	2013-10-09T02:41:22Z
dc.date.available	2013-10-09T02:41:22Z
dc.date.issued	2013-10-09
dc.identifier	AIM-323
dc.identifier	http://hdl.handle.net/1721.1/5799
dc.identifier.uri	http://koha.mediu.edu.my:8181/xmlui/handle/1721
dc.description	Will computers that see and understand what they see revolutionize industry by automating the part orientation and part inspection processes? There are two obstacles: the expense of computin and our feeble understanding of images. We believe these obstacles are fast ending. To illustrate what can be done we describe a working program that visually determines the position and orientation of silicon chips used in integrated circuits.
dc.format	16 p.
dc.format	1432189 bytes
dc.format	1027623 bytes
dc.format	application/postscript
dc.format	application/pdf
dc.language	en_US
dc.relation	AIM-323
dc.title	Orienting Silicon Integrated Circuit Chips for Lead Bonding

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