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The Effect of Periodic Silane Burst on the Properties of GaN on Si (111) Substrates

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dc.creator Zang, Keyan
dc.creator Chua, Soo-Jin
dc.creator Thompson, Carl V.
dc.date 2004-12-09T23:43:15Z
dc.date 2004-12-09T23:43:15Z
dc.date 2005-01
dc.date.accessioned 2013-10-09T02:49:25Z
dc.date.available 2013-10-09T02:49:25Z
dc.date.issued 2013-10-09
dc.identifier http://hdl.handle.net/1721.1/7362
dc.identifier.uri http://koha.mediu.edu.my:8181/xmlui/handle/1721
dc.description The periodic silane burst technique was employed during metalorganic chemical vapor deposition of epitaxial GaN on AlN buffer layers grown on Si (111). Periodic silicon delta doping during growth of both the AlN and GaN layers led to growth of GaN films with decreased tensile stresses and decreased threading dislocation densities, as well as films with improved quality as indicated by x-ray diffraction, micro-Raman spectroscopy, atomic force microscopy, and transmission electron microscopy. The possible mechanism of the reduction of tensile stress and the dislocation density is discussed in the paper.
dc.description Singapore-MIT Alliance (SMA)
dc.format 595081 bytes
dc.format application/pdf
dc.language en
dc.relation Advanced Materials for Micro- and Nano-Systems (AMMNS);
dc.subject Metal-organic Chemical Vapour Deposition
dc.subject III-V Nitrides
dc.title The Effect of Periodic Silane Burst on the Properties of GaN on Si (111) Substrates
dc.type Article


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